Thermal management of electronic components packaged inside an IP65 rated enclosure is of prime importance in industrial applications. Electrical enclosure protects the multiple board configurations such as inverter, power, controller board components, busbars, and various power dissipating components from harsh environments. Industrial environments often experience relatively warm ambient conditions, and the electronic components housed in the enclosure dissipate heat, due to which the enclosures and the components require thermal management as well as reduction of internal ambient temperatures. Design of Experiments based thermal simulation approach with MOSFET arrangement, Heat sink design, Enclosure Volume, Copper and Aluminum Spreader, Power density, and Printed Circuit Board (PCB) type were considered to optimize air temperature inside the IP65 enclosure to ensure conducive operating temperature for controller board and electronic components through the different modes of heat transfer viz. conduction, natural convection and radiation using Ansys ICEPAK. MOSFET’s with the parallel arrangement, IP65 enclosure molded heat sink with rectangular fins on both enclosures, specific enclosure volume to satisfy the power density, Copper spreader to conduct heat to the enclosure, optimized power density value and selecting Aluminum clad PCB which improves the heat transfer were the contributors towards achieving a conducive operating temperature inside the IP-65 rated Motor Inverter enclosure. A reduction of 52 ℃ was achieved in internal ambient temperature inside the IP65 enclosure between baseline and final design parameters, which met the operative temperature requirements of the electronic components inside the IP-65 rated Motor Inverter.
Due to the higher power loss levels in electronic components, the thermal design of PCBs (Printed Circuit Boards) of an assembled device becomes one of the most important quality factors in electronics. Nonetheless, some of leading causes of the microelectronic component failures are due to higher temperatures, the leakages or thermal-mechanical stress, which is a concern, is the reliability of microelectronic packages. This article presents an experimental approach to measure the junction temperature of exposed pad packages. The implemented solution is in a prototype phase, using a temperature-sensitive parameter (TSP) to measure temperature directly on the die, validating the numeric results provided by the Mechanical APDL (Ansys Parametric Design Language) under same conditions. The physical device-under-test is composed by a Thermal Test Chip (TTC-1002) and assembly in a QFN cavity, soldered to a test-board according to JEDEC Standards. Monitoring the voltage drop across a forward-biased diode, is an indirectly method but accurate to obtain the junction temperature of QFN component with an applied power range between 0,3W to 1.5W. The temperature distributions on the PCB test-board and QFN cavity surface were monitored by an infra-red thermal camera (Goby-384) controlled and images processed by the Xeneth software. The article provides a set-up to monitorize in real-time the junction temperature of ICs, namely devices with the exposed pad package (i.e. QFN). Presenting the PCB layout parameters that the designer should use to improve thermal performance, and evaluate the impact of voids in solder interface in the device junction temperature.
In recent years Li-Ion batteries getting more attention among the Electrical Vehicles (EV) and Hybrid Electrical Vehicles (HEV) energy storage. Li-Ion has shown extended power density and light weight compared to other batteries readily available in the market. One of the major drawbacks in Li-Ion batteries is their sensitivity to the temperature. If the working temperature is beyond the limit, that could affect seriously on the durability and performance of Li-Ion battery. Thus Battery Thermal Management (BTM) is the most essential in adapting Li-Ion battery to the EVs and HEVs.
When designing satellites, one of the major issues aside for designing its primary subsystems is to devise its thermal. The thermal management of satellites requires solving different sets of issues with regards to modelling. If the satellite is well conditioned all other parts of the satellite will have higher temperature no matter what. The main issue of thermal modelling for satellite design is really making sure that all the other points of the satellite will be within the temperature limits they are designed. The insertion of power electronics in aerospace technologies is becoming widespread and the modern electronic systems used in space must be reliable and efficient with thermal management unaffected by outer space constraints. Many advanced thermal management techniques have been developed in recent years that have application in high power electronic systems. This paper presents a Three-Dimensional Modal Transmission Line Matrix (3D-TLM) implementation of transient heat flow in space power electronics. In such kind of components heat dissipation and good thermal management are essential. Simulation provides the cheapest tool to investigate all aspects of power handling. The 3DTLM has been successful in modeling heat diffusion problems and has proven to be efficient in terms of stability and complex geometry. The results show a three-dimensional visualisation of self-heating phenomena in the device affected by outer space constraints, and will presents possible approaches for increasing the heat dissipation capability of the power modules.
To study the impact of the inter-module ventilation (IMV) on the space station, the Computational Fluid Dynamic (CFD) model under the influence of IMV, the mathematical model, boundary conditions and calculation method are established and determined to analyze the influence of IMV on cabin air flow characteristics and velocity distribution firstly; and then an integrated overall thermal mathematical model of the space station is used to consider the impact of IMV on thermal management. The results show that: the IMV has a significant influence on the cabin air flow, the flowrate of IMV within a certain range can effectively improve the air velocity distribution in cabin, if too much may lead to its deterioration; IMV can affect the heat deployment of the different modules in space station, thus affecting its thermal management, the use of IMV can effectively maintain the temperature levels of the different modules and help the space station to dissipate the waste heat.