In the activity of handling and transport of food products, the products may be subjected to mechanical stresses that may lead to their deterioration by deformation, breaking, or crushing. This is the case for biscuits, regardless of their type (gluten-free or sugary), the addition of ingredients or flour from which they are made. However, gluten-free biscuits have a higher mechanical resistance to breakage or crushing compared to easily shattered sugar biscuits (especially those for children). The paper presents the results of the experimental evaluation of the texture for four varieties of commercial biscuits, using the penetrometer equipped with needle cone at five different additional weights on the cone-rod. The assortments of biscuits tested in the laboratory were Petit Beurre, Picnic, and Maia (all three manufactured by RoStar, Romania) and Sultani diet biscuits, manufactured by Eti Burcak Sultani (Turkey, in packs of 138 g). For the four varieties of biscuits and the five additional weights (50, 77, 100, 150 and 177 g), the experimental data obtained were subjected to regression analysis in the MS Office Excel program, using Velon's relationship (h = a∙ln(t) + b). The regression curves were analysed comparatively in order to identify possible differences and to highlight the variation of the penetration depth h, in relation to the time t. Based on the penetration depth between two-time intervals (every 5 seconds), the curves of variation of the penetration speed in relation to time were then drawn. It was found that Velon's law verifies the experimental data for all assortments of biscuits and for all five additional weights. The correlation coefficient R2 had in most of the analysed cases values over 0.850. The values recorded for the penetration depth were framed, in general, within 45-55 p.u. (penetrometric units) at an additional mass of 50 g, respectively between 155-168 p.u., at an additional mass of 177 g, at Petit Beurre biscuits. For Sultani diet biscuits, the values of the penetration depth were within the limits of 32-35 p.u., at an additional weight of 50 g and between 80-114 p.u., at an additional weight of 177g. The data presented in the paper can be used by both operators on the manufacturing technology flow, as well as by the traders of these food products, in order to establish the most efficient parametric of the working regimes (when packaging and handling).
In accordance with the industry 4.0 concept, manufacturing process steps as well as the materials themselves are going to be more and more digitalized within the next years. The “digital twin” representing the simulated and measured dataset of the (semi-finished) product can be used to control and optimize the individual processing steps and help to reduce costs and expenditure of time in product development, manufacturing, and recycling. In the present work, two material characterization methods based on Lamb waves were evaluated and compared. For demonstration purpose, both methods were shown at a standard industrial product - copper ribbons, often used in photovoltaic modules as well as in high-current microelectronic devices. By numerical approximation of the Rayleigh-Lamb dispersion model on measured phase velocities second order elastic constants (Young’s modulus, Poisson’s ratio) were determined. Furthermore, the effective third order elastic constants were evaluated by applying elastic, “non-destructive”, mechanical stress on the samples. In this way, small microstructural variations due to mechanical preconditioning could be detected for the first time. Both methods were compared with respect to precision and inline application capabilities. Microstructure of the samples was systematically varied by mechanical loading and annealing. Changes in the elastic ultrasound transport properties were correlated with results from microstructural analysis and mechanical testing. In summary, monitoring the elastic material properties of plate-like structures using Lamb waves is valuable for inline and non-destructive material characterization and manufacturing process control. Second order elastic constants analysis is robust over wide environmental and sample conditions, whereas the effective third order elastic constants highly increase the sensitivity with respect to small microstructural changes. Both Lamb wave based characterization methods are fitting perfectly into the industry 4.0 concept.
In this paper, the problem of a mixed-Mode crack embedded in an infinite medium made of a functionally graded piezoelectric material (FGPM) with crack surfaces subjected to electro-mechanical loadings is investigated. Eringen’s non-local theory of elasticity is adopted to formulate the governing electro-elastic equations. The properties of the piezoelectric material are assumed to vary exponentially along a perpendicular plane to the crack. Using Fourier transform, three integral equations are obtained in which the unknown variables are the jumps of mechanical displacements and electric potentials across the crack surfaces. To solve the integral equations, the unknowns are directly expanded as a series of Jacobi polynomials, and the resulting equations solved using the Schmidt method. In contrast to the classical solutions based on the local theory, it is found that no mechanical stress and electric displacement singularities are present at the crack tips when nonlocal theory is employed to investigate the problem. A direct benefit is the ability to use the calculated maximum stress as a fracture criterion. The primary objective of this study is to investigate the effects of crack length, material gradient parameter describing FGPMs, and lattice parameter on the mechanical stress and electric displacement field near crack tips.
Due to the higher power loss levels in electronic components, the thermal design of PCBs (Printed Circuit Boards) of an assembled device becomes one of the most important quality factors in electronics. Nonetheless, some of leading causes of the microelectronic component failures are due to higher temperatures, the leakages or thermal-mechanical stress, which is a concern, is the reliability of microelectronic packages. This article presents an experimental approach to measure the junction temperature of exposed pad packages. The implemented solution is in a prototype phase, using a temperature-sensitive parameter (TSP) to measure temperature directly on the die, validating the numeric results provided by the Mechanical APDL (Ansys Parametric Design Language) under same conditions. The physical device-under-test is composed by a Thermal Test Chip (TTC-1002) and assembly in a QFN cavity, soldered to a test-board according to JEDEC Standards. Monitoring the voltage drop across a forward-biased diode, is an indirectly method but accurate to obtain the junction temperature of QFN component with an applied power range between 0,3W to 1.5W. The temperature distributions on the PCB test-board and QFN cavity surface were monitored by an infra-red thermal camera (Goby-384) controlled and images processed by the Xeneth software. The article provides a set-up to monitorize in real-time the junction temperature of ICs, namely devices with the exposed pad package (i.e. QFN). Presenting the PCB layout parameters that the designer should use to improve thermal performance, and evaluate the impact of voids in solder interface in the device junction temperature.
The paper is focused on the identification of limiting environmental factors of individual industrial floors on which newly developed polymer protection and repair systems with the use of secondary raw materials will be used. These mainly include floors with extreme stresses and special requirements for materials used. In relation to the environment of a particular industrial floor, it is necessary to ensure, for example, chemical stability, resistance to higher temperatures, resistance to higher mechanical stress, etc. for developed materials, which is reflected in the demands for the developed material systems. The paper describes individual environments and, in relation to them, also requirements for individual components of the developed materials and for the developed materials as a whole.
Mechanical stress has a strong effect on the magnitude of the Barkhausen-noise in structural steels. Because the measurements are performed at the surface of the material, for a sample sheet, the full effect can be described by a biaxial stress field. The measured Barkhausen-noise is dependent on the orientation of the exciting magnetic field relative to the axis of the stress tensor. The sample inhomogenities including the residual stress also modifies the angular dependence of the measured Barkhausen-noise. We have developed a laboratory device with a cross like specimen for bi-axial bending. The measuring head allowed performing excitations in two orthogonal directions. We could excite the two directions independently or simultaneously with different amplitudes. The simultaneous excitation of the two coils could be performed in phase or with a 90 degree phase shift. In principle this allows to measure the Barkhausen-noise at an arbitrary direction without moving the head, or to measure the Barkhausen-noise induced by a rotating magnetic field if a linear superposition of the two fields can be assumed.
Two micromechanical models for 3D smart composite with embedded periodic or nearly periodic network of generally orthotropic reinforcements and actuators are developed and applied to cubic structures with unidirectional orientation of constituents. Analytical formulas for the effective piezothermoelastic coefficients are derived using the Asymptotic Homogenization Method (AHM). Finite Element Analysis (FEA) is subsequently developed and used to examine the aforementioned periodic 3D network reinforced smart structures. The deformation responses from the FE simulations are used to extract effective coefficients. The results from both techniques are compared. This work considers piezoelectric materials that respond linearly to changes in electric field, electric displacement, mechanical stress and strain and thermal effects. This combination of electric fields and thermo-mechanical response in smart composite structures is characterized by piezoelectric and thermal expansion coefficients. The problem is represented by unitcell and the models are developed using the AHM and the FEA to determine the effective piezoelectric and thermal expansion coefficients. Each unit cell contains a number of orthotropic inclusions in the form of structural reinforcements and actuators. Using matrix representation of the coupled response of the unit cell, the effective piezoelectric and thermal expansion coefficients are calculated and compared with results of the asymptotic homogenization method. A very good agreement is shown between these two approaches.
In this work the effects of uniaxial mechanical stress on a pixel readout circuit are theoretically analyzed. It is the effects of mechanical stress on the in-pixel transistors do not arise at the output, when a correlated double sampling circuit is used. However, mechanical stress effects on the photodiode will directly appear at the readout chain output. Therefore, compensation techniques are needed to overcome this situation. Moreover simulation technique of mechanical stress is proposed and diverse layout as well as design recommendations are put forward, in order to minimize stress related effects on the output of a circuit. he shown, that wever, Moreover, a out
This paper presents the experimental results on effect of applied voltage stress frequency to the occurrence of electrical treeing in 22 kV cross linked polyethylene (XLPE) insulated cable.Hallow disk of XLPE insulating material with thickness 5 mm taken from unused high voltage cable was used as the specimen in this study. Stainless steel needle was inserted gradually into the specimen to give a tip to earth plane electrode separation of 2.50.2 mm at elevated temperature 105-110°C. The specimen was then annealed for 5 minute to minimize any mechanical stress build up around the needle-plane region before it was cooled down to room temperature. Each specimen were subjected to the same applied voltage stress level at 8 kV AC rms, with various frequency, 50, 100, 500, 1000 and 2000 Hz. Initiation time, propagation speed and pattern of electrical treeing were examined in order to study the effect of applied voltage stress frequency. By the experimental results, initial time of visible treeing decreases with increasing in applied voltage frequency. Also, obviously, propagation speed of electrical treeing increases with increasing in applied voltage frequency.Furthermore, two types of electrical treeing, bush-like and branch-like treeing were observed.The experimental results confirmed the effect of voltage stress frequency as well.