International Science Index

3
9999847
A Novel Approach of Multilevel Inverter with Reduced Power Electronics Devices
Abstract:

In this paper family of multilevel inverter topology with reduced number of power switches is presented. The proposed inverter can generate both even and odd level. The proposed topology is suitable for symmetric structure. The proposed symmetric inverter results in reduction of power switches, power diode and gate driver circuits and also it may further minimize the installation area and cost. To prove the superiority of proposed topology is compared with conventional topologies. The performance of this symmetric multilevel inverter has been tested by computer based simulation and prototype based experimental setup for nine-level inverter is developed and results are verified.

Paper Detail
2812
downloads
2
9998235
Fuzzy Logic Controller Based Shunt Active Filter with Different MFs for Current Harmonics Elimination
Abstract:

One of the major power quality concerns in modern times is the problem of current harmonics. The current harmonics is caused due to the increase in non-linear loads which is largely dominated by power electronics devices. The Shunt active filtering is one of the best solutions for mitigating current harmonics. This paper describes a fuzzy logic controller based (FLC) based three Phase Shunt active Filter to achieve low current harmonic distortion (THD) and Reactive power compensation. The performance of fuzzy logic controller is analysed under both balanced sinusoidal and unbalanced sinusoidal source condition. The above controller serves the purpose of maintaining DC Capacitor Voltage constant. The proposed shunt active filter uses hysteresis current controller for current control of IGBT based PWM inverter. The simulation results of model in Simulink MATLAB reveals satisfying results.

Paper Detail
2360
downloads
1
2941
Packaging and Interconnection Technologies of Power Devices, Challenges and Future Trends
Authors:
Abstract:
Standard packaging and interconnection technologies of power devices have difficulties meeting the increasing thermal demands of new application fields of power electronics devices. Main restrictions are the decreasing reliability of bond-wires and solder layers with increasing junction temperature. In the last few years intensive efforts have been invested in developing new packaging and interconnection solutions which may open a path to future application of power devices. In this paper, the main failure mechanisms of power devices are described and principle of new packaging and interconnection concepts and their power cycling reliability are presented.
Paper Detail
2140
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