In a state-of-the-art industrial production line of
photovoltaic products the handling and automation processes are of
particular importance and implication. While processing a fully
functional crystalline solar cell an as-cut photovoltaic wafer is subject
to numerous repeated handling steps. With respect to stronger
requirements in productivity and decreasing rejections due to defects
the mechanical stress on the thin wafers has to be reduced to a
minimum as the fragility increases by decreasing wafer thicknesses.
In relation to the increasing wafer fragility, researches at the
Fraunhofer Institutes IPA and CSP showed a negative correlation
between multiple handling processes and the wafer integrity. Recent
work therefore focused on the analysis and optimization of the dry
wafer stack separation process with compressed air. The achievement
of a wafer sensitive process capability and a high production
throughput rate is the basic motivation in this research.