Improved Pattern Matching Applied to Surface Mounting Devices Components Localization on Automated Optical Inspection
Automated Optical Inspection (AOI) Systems are commonly used on Printed Circuit Boards (PCB) manufacturing. The use of this technology has been proven as highly efficient for process improvements and quality achievements. The correct extraction of the component for posterior analysis is a critical step of the AOI process. Nowadays, the Pattern Matching Algorithm is commonly used, although this algorithm requires extensive calculations and is time consuming. This paper will present an improved algorithm for the component localization process, with the capability of implementation in a parallel execution system.
 G. Acciani, G. Brunetti and G. Fornarelli, “A Multiple Neural Network System to Classify Solder Joints on Integrated Circuits”, International Journal of computational intelligence Research (2006) Vol. 2, No 4, pp 337-348
 Tae-Hyeon Kim, Tai-Hoon Cho, Young-Shik Moon and Sung-Han Park, “Visual Inspection System for Classification of Solder Joints”, Pattern Recognition 32 (1999), pp 565-575
 Kuk Won Ko and Hyung Suck Cho, “Solder Joints Inspection Using Neural Network and Fuzzy Rule-Based Classification”, IEEE 98, pp. 1565-1570
 Pedro M. A. Vitoriano, Tito G. Amaral, Octávio Páscoa Dias, “Automatic Optical Inspection for Surface Mounting Devices with IPC-A-610D compliance.” IEEE 4/11, 978-1-4244-9843-7
 Parallel Programming for Everyone – Take Advantage of Multicore CPUs with LabVIEW, (2016, October 20). Retrieved from http://www.ni.com/newsletter/51020/en/
 Multicore Programming with LabVIEW Technical Resource Guide, (2016, October 20). Retrieved from ftp://ftp.ni.com/evaluation/labview/ekit/multicore_programming_resource_guide.pdf